On March 17, Samsung announced it would be mass producing its 512 GB mobile device memory chips. The South Korean manufacturer’s latest storage offering will allow users to seamlessly capture content in 8K resolution. The firm is also reportedly developing a 150-megapixel smartphone image sensor.
Samsung’s New eUFS 3.1 Memory Chips
Samsung designed its new handset memory chips to meet the version 3.1 embedded universal flash storage (eUFS) standard. As a result, the component has a read speed of 2,100 Mbps and a write speed of 1200 Mbps. As such, the firm’s latest storage solution is three times faster than the previous generation.
By comparison, a personal computer connected to its internal storage via a SATA cable has a maximum write speed of 540 MBps. Similarly, ultra-high-speed microSD cards can only record information at a rate of 90 MBps.
The semiconductor company’s 3.1 eUFS chips also boast a high rate of input/output operations per second (IOPS). The component can perform 100,000 read IOPS and 70,000 write IOPS. In practical terms, Samsung’s new smartphone storage can record large-size image files and 8K video without buffering.
Samsung debuted its eUPS 3.1 chips with its Galaxy S20 line of smartphones. But now the conglomerate is making its robust memory solution available to other manufacturers. The firm expects the widespread availability of its storage components to provide consumers with a new level of handset utility.
“With our introduction of the fastest mobile storage, smartphone users will no longer have to worry about the bottleneck they face with conventional storage cards,” stated Samsung executive vice president Cheol Choi.
The corporation is also mass-producing eUFS 3.1 chips in 128 GB and 256 GB capacities.
Samsung Might Release a 150-Megapixel Image Sensor
On Tuesday, GizChina broke the news that the South Korean manufacturer is working on a 150-megapixel image sensor. Presently, the corporation is the world’s only maker of mobile device chips that can capture content at 100+ megapixels.
Last month, The Burn-In reported Samsung embedded a 108-megapixel wide-angle sensor in its Galaxy S20 Ultra flagship handset. The company unveiled that breakthrough in smartphone imaging technology last year with the debut of Xiaomi’s CC9 Pro.
According to GSMArena, Samsung will introduce the world to its 150-megapixel smartphone sensor with a Xiaomi device set for release in the fourth quarter of 2020. Subsequently, Chinese handset manufacturers Vivo and Oppo will release smartphones equipped with the next-generation component in Q1 2021.
Consumers have an insatiable hunger for novelty in their electronic devices. That desire helped make the Galaxy Fold and Huawei Mate X major sellers. Thanks to Samsung’s commitment to innovation, buyers can look forward to getting their hands on smartphones with remarkable storage capacity and photographic capability soon.